Looking into the PCB benefits, this slide shows a comparison between the LFPAK56D dual package in a bridge connection configuration against the LFPAK56D half-bridge package. In the case of the LFPAK56D, the designer will route under the board, using vias to connect the high side and low side MOSFETs. This method adds loops and inductance, and also breaks the ground plane, which is a key consideration for a design engineer. Comparing against the half-bridge, there is no need for any vias. This means there is a significant amount of extra space, which can be used to place extra components or additional heat sinking space. Additionally, these benefits mean there is no breakage in the ground plane, leading to a much simpler PCB design.