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The LFPAK56D half-bridge comes with all the known LFPAK benefits. Board-level reliability being one of these, the LFPAK package allows for thermal expansion when the module temperature fluctuates during operation, especially in thermally-demanding powertrain applications. This is unlike QFN packages which do not allow for any movement, meaning cracks in the solder joints which potentially result in electrical failures.
PTM Published on: 2021-05-24
Greece