The true benefit of the half-bridge is around the reduction of tracks on the PCB. In the example here on the left is a dual MOSFET. To make a high side and low side connection, one would route under the board to make the S₁D₂ connection between the two MOSFETs. This adds additional inductance into the design and can impact the ground plane as well as the thermal paths. In the case of the half-bridge, the connection is made internally using Nexperia’s innovative packaging technology, removing the need of the connecting track on the PCB. This supports lower system level inductance and offers a simple plug-and-play solution for design engineers.