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Overview

Beginning with a summary, Nexperia has extended their offering in high-robust high-quality LFPAK packaging technology with the LFPAK56D half-bridge package, a variant of the LFPAK56D dual package. It uses the same manufacturing process, but with a new internal clip technology. The package is focused on high-reliability applications such as powertrain and chassis and safety spaces at 40 V. Nexperia’s focus is on a simplified PCB design, reducing system complexities and supporting lower system-level inductance.

PTM Published on: 2021-05-24