In summary, Nexperia’s LFPAK56D package is a series of half-bridge (high side and low side) MOSFETs constructed in a space-saving format. This series occupies 30% lower PCB area compared to dual MOSFETs for 3-phase motor control topologies due to the removal of PCB tracks while permitting simple automated optical inspection (AOI) during production. The LFPAK56D half-bridge utilizes existing high-volume LFPAK56D assembly processes, with proven automotive reliability. The package format uses flexible leads to improve overall reliability, and an internal copper clip connection between the MOSFETs simplifies PCB designs and brings a plug-and-play style solution with exceptional current handling capability.