Power requirements of new set-top box chipsets are increasing due to the need for higher computing power (to meet new standards and enable multi-functionality) and the utilization of smaller geometries for new digital chips (lower voltage, higher current operation). This trend, combined with the new, strict efficiency standards, will greatly effect set-top box power architecture, since it will result in a higher number of switch-mode DC/DC converters being utilized in new designs. In order to meet these requirements, it is essential that efficient and cost-effective thermal management solutions are used.
 
                 
                 
                 
 
 
 
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