 Texas Instruments' CC2564MODA module is a complete Bluetooth BR/EDR/LE HCI solution based on TI’s CC2564B, dual-mode, Bluetooth single-chip device. This reduces design effort and enables fast time-to-market. The CC2564MODA module includes TI’s seventh-generation core and provides a product-proven solution that is Bluetooth 4.1 compliant. The CC2564MODA module provides best-in-class RF performance with a transmit power and receive sensitivity that provides a range of about 2X compared to other BLE-only solutions. Furthermore, TI’s power management hardware and software algorithms provide significant power savings in all commonly used Bluetooth BR/EDR/LE modes of operation.
Texas Instruments' CC2564MODA module is a complete Bluetooth BR/EDR/LE HCI solution based on TI’s CC2564B, dual-mode, Bluetooth single-chip device. This reduces design effort and enables fast time-to-market. The CC2564MODA module includes TI’s seventh-generation core and provides a product-proven solution that is Bluetooth 4.1 compliant. The CC2564MODA module provides best-in-class RF performance with a transmit power and receive sensitivity that provides a range of about 2X compared to other BLE-only solutions. Furthermore, TI’s power management hardware and software algorithms provide significant power savings in all commonly used Bluetooth BR/EDR/LE modes of operation.
The TI dual-mode Bluetooth Stack software is certified and provided royalty free for TI’s MSP430 and ARM® Cortex®-M3 and Cortex®-M4 MCUs. Other MPUs can be supported through TI’s third party. iPod® (MFi) protocol is supported by add-on software packages. For more information, see TI dual-mode Bluetooth Stack. Some of the profiles supported include the following:
    
        
        
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                Serial port profile (SPP)Advanced audio distribution profile (A2DP)Audio/video remote control profile (AVRCP) | 
                Handsfree profile (HFP)Human interface device (HID) | 
                Generic attribute profile (GATT)Several LE profiles and services | 
        
    
For more information on TI’s wireless platform solutions for Bluetooth, see 
TI’s CC256x wiki.
    
        
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                Module solution based on TI’s CC2564B, dual-mode Bluetooth single chip with Bluetooth basic rate (BR), enhanced data rate (EDR), and low-energy (LE) support
                
                    CC2564MODA with integrated antennaHighly optimized for design into small form factor systems and flexibility:
                    
                        Integrated chip antennaModule footprint: 35 terminals, 0.8 mm pitch, 7 mm x 14 mm x 1.4 mm (typical) |  | 
                Fully certified Bluetooth 4.1 module
                
                    FCC (Z64-2564N)/IC (451I-2564N) modular grant (see Section 6.2.1.3, antenna, section 7.1.1, FCC certification, and section 7.1.2, IC certification)CE certified as summarized in the declaration of conformity (see section 7.1.3, ETSI/CE certification)Bluetooth 4.1 controller subsystem qualified (QDID 64631)
                    
                        Compliant up to the HCI layer |