WE-PCM: Thermal Phase Changing Material
Würth Elektronik's WE-PCM is designed to provide a seamless thermal interface between a component and a cooling assembly
Wurth Elektronik's WE-PCM series is designed as an alternative to the use of thermal pastes and greases between high-performance components, such as processors or power components and cooling assemblies. This material changes from a solid to liquid at a specific temperature providing a complete wet-out of the interface without any spills or overflow. The phase changing material itself is composed of three main components:
- Release PET film: The WE-PCM is protected by two PET films on top and bottom to protect the material from foreign particles. The PET films must be removed before placing the material.
- Phase changing material: Main component of the product.
- Polyimide film: This component is present in some of the standard parts to provide electrical insulation while maintaining its thermally conductive capabilities.
The WE-PCM is designed to provide a seamless thermal interface between a component and a cooling assembly. A benefit of the complete wet-out of the contact surfaces as well as the thinness is that the thermal resistance provided by the material is very low compared to other interface solutions.
Resources
- No MOQ or tooling costs
- Alternative to thermal pastes and greases
- Electrically insulating if required
- Lower thermal resistance than other TIM solutions
- Easy to handle in manufacturing environments
- Power supplies
- Transistors: FETs, IGBTs
- SiC and GaN
- High-speed systems: FPGAs, CPUs, and GPUs
- ICs: ADCs, DACs, and memory modules