TG-N8000 Non-Silicone Putty

T-Global’s TG-N8000 non-silicone thermal putty is a high-performance thermally conductive gap filler designed for demanding applications and offering long-term reliable performance.

TG-N8000 non-silicone thermal putty is a high-performance liquid gap filler. With a high thermal conductivity of 8 W/mK and the ability to effectively wet the thermal interface surfaces, it is suitable for the most demanding applications. TG-N8000 non-silicone thermal putty has a non-solid putty-like consistency which makes it ideal for interfaces with poor surface finishes, high tolerances, and multiple heat sources. TG-N8000 is available in syringes and pails for easy dispensing and high-volume mass production applications.