E-REON B.V.

About

  • Development of RF and Microwave Components, Modules and Systems (Active and Passive)
  • Analysis Services: 3D EM, Electrothermal Studies, Thermal Management, Heatsink Design, CFD Studies
  • Design Support Services: ECAD, MCAD, System Design
  • Product Development Support Services: ECAM, ECAE, MCAM, MCAE (In-House)
  • General Digital/Analog
  • High Density/BGA
  • PCB Design/Layout
  • Schematic Capture
  • Design for Manufacturing
  • High Volume Production
  • Low to Medium Volume Production
  • Prototype Assembly
  • Prototype Testing
  • Test Fixture Development
  • Turnkey Volume Production
  • Enclosure Design
  • Full Product 3D Modeling
  • PCB and Component 3D Modeling
  • DSP Algorithms
  • Linux
  • RTOS
  • Analog Simulation
  • Block Level System Design and Integration
  • Communications Systems
  • Design for EMI/RFI Immunity
  • Design for Testability
  • Antennas
  • LoRa
  • RF Design
  • Wi-Fi
  • ZigBee
  • Aerospace
  • Consumer
  • Energy
  • Industrial
  • IoT
  • Medical
  • Military
  • Telecommunications
  • NXP
  • Analog Devices
  • Microchip
  • NXP
  • Texas Instruments

Contact

E-REON B.V.
+31616020096
info@e-reon.com
Andreas Koroulis
ankor@e-reon.com
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