Power Management - Specialized

Results: 1.358
Series
-*
Packaging
BulkCut Tape (CT)Digi-Reel®Tape & Reel (TR)TrayTube
Product Status
ActiveDiscontinued at Digi-KeyLast Time BuyNot For New DesignsObsolete
Applications
-Airbag SystemAudio, VideoBattery Management, Display (LED Drivers), Handheld/Mobile Devices, Power SupplyCameraContact MonitorController, Wireless Power TransmitterDesktop, Notebook PCsEmbedded Systems, Low-Power IoT, Mobile/Wearable DevicesGeneral PurposeGeneral Purpose, Supervisor, SequenceHandheld/Mobile Devices
Current - Supply
4.5µA5µA5.5µA9µA10µA20µA23µA29µA30µA35µA40µA55µA
Voltage - Supply
0V ~ 440V0V ~ 72V0.4 ~ 14V0.9V ~ 4.2V1V ~ 5V1.6V ~ 3.6V1.71V ~ 3.6V1.8V ~ 4.5V2V ~ 28V2.5V ~ 4.5V2.5V ~ 5.5V2.7V ~ 3.6V
Operating Temperature
-40°C ~ 105°C (TA)-40°C ~ 105°C-40°C ~ 115°C (TA)-40°C ~ 120°C-40°C ~ 125°C (TA)-40°C ~ 125°C (TJ)-40°C ~ 125°C-40°C ~ 150°C (TA)-40°C ~ 150°C (TJ)-40°C ~ 85°C (TA)-40°C ~ 85°C-20°C ~ 85°C (TA)-20°C ~ 85°C-10°C ~ 65°C
Grade
-Automotive
Qualification
-AEC-Q100
Mounting Type
Surface MountSurface Mount, Wettable FlankThrough Hole
Package / Case
8-DIP (0.300", 7.62mm)8-SOIC (0.154", 3.90mm Width) Exposed Pad8-SOIC (0.154", 3.90mm Width)9-SIP Exposed Tab9-SIP Formed Leads13-SIP Formed Leads14-SOIC (0.154", 3.90mm Width)16-SOIC (0.154", 3.90mm Width)16-SOIC (0.295", 7.50mm Width)17-SIP Formed Leads20-SOIC (0.295", 7.50mm Width)20-SOIC (0.433", 11.00mm Width) Exposed Pad
Supplier Device Package
8-DIP8-HSO8-SO8-SOIC9-PDBS9-SIL MPF13-PDBS13-PRDBS14-SO14-SOIC16-SO16-SOIC
Stocking Options
Environmental Options
Media
Marketplace Product
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Mfr Part #
Quantity Available
Price
Series
Package
Product Status
Applications
Current - Supply
Voltage - Supply
Operating Temperature
Grade
Qualification
Mounting Type
Package / Case
Supplier Device Package
56-HVQFN
PCA9450AAHNY
PMIC FOR I.MX8M MINI 845S 56HVQF
NXP USA Inc.
2.287
In Stock
1 : 5,98000 €
Cut Tape (CT)
2.000 : 3,00228 €
Tape & Reel (TR)
-
Tape & Reel (TR)
Cut Tape (CT)
Digi-Reel®
Activei.MX Processors23µA2.7V ~ 5.5V-40°C ~ 105°C (TA)--Surface Mount56-VFQFN Exposed Pad56-HVQFN (7x7)
56-HVQFN
PCA9450CHNY
PMIC I.MX 8M MINI/NANO/PLUS HVQF
NXP USA Inc.
18.544
In Stock
1 : 6,09000 €
Cut Tape (CT)
2.000 : 3,06057 €
Tape & Reel (TR)
-
Tape & Reel (TR)
Cut Tape (CT)
Digi-Reel®
ActiveGeneral Purpose20µA2.85V ~ 5.5V-40°C ~ 105°C--Surface Mount56-VFQFN Exposed Pad56-HVQFN (7x7)
48-QFN
MC32PF3000A1EP
IC POWER MANAGEMENT 48QFN
NXP USA Inc.
271
In Stock
1 : 7,37000 €
Tray
-
Tray
Activei.MX Processors-2.8V ~ 5.5V-40°C ~ 85°C--Surface Mount48-VFQFN Exposed Pad48-HVQFN (7x7)
186-PBGA
MC13892DJVLR2
IC PWR MGMT I.MX35/51 186BGA
NXP USA Inc.
797
In Stock
1 : 10,66000 €
Cut Tape (CT)
1.000 : 6,04611 €
Tape & Reel (TR)
-
Tape & Reel (TR)
Cut Tape (CT)
Digi-Reel®
ActiveBattery Management, Display (LED Drivers), Handheld/Mobile Devices, Power Supply---40°C ~ 85°C--Surface Mount186-LFBGA186-PBGA (12x12)
206-MAPBGA 13x13
MC34708VM
IC POWER MANAGEMENT 206MAPBGA
NXP USA Inc.
217
In Stock
1 : 13,96000 €
Tray
-
Tray
ActiveGeneral Purpose-1.8V ~ 4.5V-40°C ~ 85°C--Surface Mount206-LFBGA206-MAPBGA (13x13)
25-WLCSP
PCA9420UKZ
POWER MANAGEMENT IC FOR LOW-POWE
NXP USA Inc.
13.144
In Stock
1 : 2,05000 €
Cut Tape (CT)
3.000 : 1,36447 €
Tape & Reel (TR)
-
Tape & Reel (TR)
Cut Tape (CT)
Digi-Reel®
ActiveMicrocontroller, MCU-3.3V ~ 5.5V-40°C ~ 85°C (TA)--Surface Mount25-UFBGA, WLCSP25-WLCSP (2.09x2.09)
PCA9420BS
PCA9420BSAZ
PCA9420BS
NXP USA Inc.
2.248
In Stock
1 : 3,02000 €
Cut Tape (CT)
1.400 : 1,78839 €
Tape & Reel (TR)
-
Tape & Reel (TR)
Cut Tape (CT)
Digi-Reel®
Active-4.5µA3.3V ~ 5.5V-40°C ~ 85°C (TA)--Surface Mount24-VFQFN Exposed Pad24-HVQFN (3x3)
56-HVQFN
PCA9450BHNY
PMIC I.MX 8M MINI/NANO/PLUS HVQF
NXP USA Inc.
11.226
In Stock
1 : 5,81000 €
Cut Tape (CT)
2.000 : 2,91483 €
Tape & Reel (TR)
-
Tape & Reel (TR)
Cut Tape (CT)
Digi-Reel®
ActiveGeneral Purpose20µA2.85V ~ 5.5V-40°C ~ 105°C--Surface Mount56-VFQFN Exposed Pad56-HVQFN (7x7)
14-SOIC-SOT108-1
TEA2208T/1J
BRIDGE RECTIFIER CONTROLLER S014
NXP USA Inc.
2.756
In Stock
1 : 6,38000 €
Cut Tape (CT)
2.500 : 3,48305 €
Tape & Reel (TR)
-
Tape & Reel (TR)
Cut Tape (CT)
Digi-Reel®
ActiveDesktop, Notebook PCs2mA0V ~ 440V-40°C ~ 125°C (TJ)--Surface Mount14-SOIC (0.154", 3.90mm Width)14-SO
16-SOIC
MC33664ATL1EGR2
TRANSFORMER PHYSICAL LAYER
NXP USA Inc.
1.928
In Stock
1 : 7,77000 €
Cut Tape (CT)
2.500 : 4,24300 €
Tape & Reel (TR)
-
Tape & Reel (TR)
Cut Tape (CT)
Digi-Reel®
ActiveIsolated Communications Interface40mA4.5V ~ 5.5V-40°C ~ 125°C (TA)--Surface Mount16-SOIC (0.154", 3.90mm Width)16-SOIC
186-PBGA
MC13892CJVLR2
IC PWR MGMT I.MX35/51 186BGA
NXP USA Inc.
617
In Stock
1 : 10,66000 €
Cut Tape (CT)
1.000 : 6,04611 €
Tape & Reel (TR)
-
Tape & Reel (TR)
Cut Tape (CT)
Digi-Reel®
ActiveBattery Management, Display (LED Drivers), Handheld/Mobile Devices, Power Supply---40°C ~ 85°C--Surface Mount186-LFBGA186-PBGA (12x12)
56-HVQFN
MC34VR500V5ES
REGULATOR BUCK QUAD WITH UP TO
NXP USA Inc.
306
In Stock
1 : 11,68000 €
Tray
-
Tray
ActiveQorlQ LS1/T1 Communications Processors2A2.8V ~ 4.5V-40°C ~ 105°C (TA)--Surface Mount, Wettable Flank56-VFQFN Exposed Pad56-QFN-EP (8x8)
32 QFN
MFS5600AMMA0ES
IC FS56 SYSTEM BASIS
NXP USA Inc.
1.380
In Stock
1 : 4,60000 €
Tray
-
Tray
Active-140µA2.7V ~ 36V-40°C ~ 125°C (TA)AutomotiveAEC-Q100Surface Mount, Wettable Flank32-VFQFN Exposed Pad32-HVQFN (5x5)
32 QFN
MFS5600AMMA7ES
IC BUCK QM 5.0V / 3.3V 32-QFN
NXP USA Inc.
303
In Stock
1 : 4,60000 €
Tray
-
Tray
Active-140µA2.7V ~ 36V-40°C ~ 125°C (TA)AutomotiveAEC-Q100Surface Mount, Wettable Flank32-VFQFN Exposed Pad32-HVQFN (5x5)
48-QFN
MC34PF3001A7EP
IC POWER MANAGEMENT 48QFN
NXP USA Inc.
1.935
In Stock
1 : 6,01000 €
Tray
-
Tray
ActiveProcessor-2.8V ~ 5.5V-40°C ~ 105°C--Surface Mount48-VFQFN Exposed Pad48-HVQFN (7x7)
48-QFN
MC34PF3001A1EP
IC POWER MANAGEMENT 48QFN
NXP USA Inc.
260
In Stock
1 : 6,76000 €
Tray
-
Tray
ActiveProcessor-2.8V ~ 5.5V-40°C ~ 105°C--Surface Mount48-VFQFN Exposed Pad48-HVQFN (7x7)
48-QFN
MC34PF3001A3EP
IC POWER MANAGEMENT 48QFN
NXP USA Inc.
260
In Stock
1 : 6,76000 €
Tray
-
Tray
ActiveProcessor-2.8V ~ 5.5V-40°C ~ 105°C--Surface Mount48-VFQFN Exposed Pad48-HVQFN (7x7)
56-HVQFN
MC32PF8121A0EP
IC POWER MANAGEMENT
NXP USA Inc.
260
In Stock
1 : 6,90000 €
Tray
-
Tray
ActiveIndustrial, IoT-2.5V ~ 5.5V-40°C ~ 85°C (TA)--Surface Mount, Wettable Flank56-VFQFN Exposed Pad56-HVQFN (8x8)
48-QFN
MC32PF3000A3EP
POWER MANAGEMENT IC I.MX7 PRE-
NXP USA Inc.
260
In Stock
1 : 7,37000 €
Tray
-
Tray
Activei.MX Processors-2.8V ~ 5.5V-40°C ~ 85°C--Surface Mount48-VFQFN Exposed Pad48-HVQFN (7x7)
48-QFN
MC32PF3000A7EP
POWER MANAGEMENT IC I.MX7 PRE-
NXP USA Inc.
260
In Stock
1 : 7,37000 €
Tray
-
Tray
Activei.MX Processors-2.8V ~ 5.5V-40°C ~ 85°C--Surface Mount48-VFQFN Exposed Pad48-HVQFN (7x7)
48-QFN
MC34PF3000A0EP
IC POWER MANAGEMENT 48QFN
NXP USA Inc.
1.378
In Stock
1 : 8,03000 €
Tray
-
Tray
Activei.MX Processors-2.8V ~ 5.5V-40°C ~ 105°C--Surface Mount48-VFQFN Exposed Pad48-HVQFN (7x7)
48-QFN
MC34PF3000A3EP
IC POWER MANAGEMENT 48QFN
NXP USA Inc.
520
In Stock
1 : 8,03000 €
Tray
-
Tray
Activei.MX Processors-2.8V ~ 5.5V-40°C ~ 105°C--Surface Mount48-VFQFN Exposed Pad48-HVQFN (7x7)
48-QFN
MC34PF3000A7EP
IC POWER MANAGEMENT 48QFN
NXP USA Inc.
260
In Stock
1 : 8,03000 €
Tray
-
Tray
Activei.MX Processors-2.8V ~ 5.5V-40°C ~ 105°C--Surface Mount48-VFQFN Exposed Pad48-HVQFN (7x7)
48-LQFP-EP
MC33FS6510CAE
SYSTEM BASIS CHIP DCDC 1.5A VCO
NXP USA Inc.
250
In Stock
1 : 8,11000 €
Tray
-
Tray
ActiveSystem Basis Chip-1V ~ 5V-40°C ~ 125°C--Surface Mount48-LQFP Exposed Pad48-HLQFP (7x7)
48 HVQFN
MPF7100BMMA0ES
PF7100 PMIC OTP
NXP USA Inc.
476
In Stock
1 : 8,31000 €
Tray
-
Tray
Activei.MX Processors10µA2.5V ~ 5.5V-40°C ~ 125°C (TA)--Surface Mount, Wettable Flank48-VFQFN Exposed Pad48-HVQFN (7x7)
Showing
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Power Management - Specialized

Specialized power management integrated circuits (PMICs) are used for control or manipulation of electrical power in purpose specific or narrowly targeted applications such as automotive airbag management, capacitor bank balancing, monitoring of AC utility power, memory bus termination, ground fault detection, energy harvesting, small engine management, processor or chipset specific voltage regulation, load dump protection, haptic drivers, thermoelectric cooler control, and others.